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Green 6 Layer PCB Printed Circuit Board FR4 Material S2600F Immersion Gold

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Witgain Technology Ltd

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Green 6 Layer PCB Printed Circuit Board FR4 Material S2600F Immersion Gold

Name: Green 6 Layer PCB Printed Circuit Board FR4 Material S2600F Immersion Gold
Brand: WITGAIN PCB
Price: 1 USD

Green 6 Layer PCB Printed Circuit Board FR4 Material S2600F Immersion Gold Manufactures

Brand Name : WITGAIN PCB

Model Number : P06E3820A0

Certification : UL Certificate

Place of Origin : China

MOQ : negotiable

Price : negotiable

Payment Terms : T/T

Supply Ability : 500kpcs/month

Delivery Time : 20 work days

Packaging Details : 40pcs/bag, 20bags/carton

Layer Count : 6 Layer

Material : FR4

Board Thickness : 1.6MM

Solder Mask : Green

Surface Treatment : ENIG

Material Brand : SY , S2600F

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6 Layer Printed Circuit Board , FR4 Material , S2600F , Immersion Gold

6 Layer Printed Circuit Board

PCB Specifications:

Layer Count: 6 Layer Rigid PCB:

Material: FR4 S2600F

Board Thickness: 1.6MM

Min Hole: 0.3MM

Min Trace: 5/5Mil

BGA Size: 12Mil

Solder Mask: Green

Surface Treatment: ENIG

Application: Power Supply

Capabilities:

Item	Capability
Layer Count	1-24 Layers
Board Thickness	0.1mm-6.0mm
Finished Board Max Size	700mm* 800mm
Finished Board Thickness Tolerance	+/-10% +/-0.1(<1.0mm)
Warp	<0.7%
Major CCL Brand	KB/NanYa/LTEQ/ShengYi/Rogers Etc
Material Type	FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET
Drill Hole Diameter	0.1mm-6.5mm
Out Layer Copper Thickness	1/20Z-8OZ ;
Inner Layer Copper Thickness	1/3OZ-6OZ
Aspect Ratio	10:1
PTH Hole Tolerance	+/-3mil
NPTH Hole Tolerance	+/-1mil
Copper Thickness Of PTH Wall	>10mil(25um)
Line Width And Space	2/2mil
Min Solder Mask Bridge	2.5mil
Solder Mask Alignment Tolerance	+/-2mil
Dimension Tolerance	+/-4mil
Max Gold Thickness	200u'(0.2mil)
Thermal Shock	288C, 10s, 3 Times
Impedance Contro	+/-10%
LTest Capability	PAD Size Min 0.1mm
Min BGA	7mil
Surface Treatment	OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable

FAQ:

Question: What is via in pad

Answer: For some pcbs, due to the limited space, the via holes need to be designed on BGA pad. In order to meet this design requirement, we need to drill the hole on bga pad first, then PTH the hole and use resin to plug in the hole. From the pad surface, we won't see any holes. So it won't affect SMT function.

Product Tags:

6 layer printed circuit board

custom made circuit boards

Green 6 Layer PCB Printed Circuit Board FR4 Material S2600F Immersion Gold Images

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